Product

4H n-Type

4H n-Type SiC Substrate

Current > 4H n-Type
N-type SiC substrate materials are primarily used for homoepitaxial growth in the fabrication of power semiconductor devices.
They are widely applied in new energy sectors such as electric vehicles, as well as in photovoltaic and wind power generation.
Currently, SICC's 6-inch and 8-inch products are consistently delivered to global customers for volume production, while also
possessing the capability to produce 12-inchsubstrate products.

*Please contact our sales for more detailed information.

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Specifications

6-inch
  • Diameter 150.0mm+0mm/-0.2mm
  • Surface Orientation 4°toward±0.5°
  • Primary Flat Length 47.5 mm ±1.5 mm
  • Primary Flat Orientation <1120>±1.0°
  • Notch Orientation /
  • Notch Angle /
  • Notch Depth /
  • Secondary Flat N/A
  • Thickness 350.0um士25.0um
  • Polytype 4H
  • Type n-type

*Please contact our sales for more detailed information.

>Contact us

Specifications

8-inch
  • Diameter 200.0mm+0mm/-0.5mm
  • Surface Orientation 4°toward±0.5°
  • Primary Flat Length Notch
  • Primary Flat Orientation /
  • Notch Orientation <1100>±1.0°
  • Notch Angle 90°+5°/-1°
  • Notch Depth 1.0mm+0.25mm/-0mm
  • Secondary Flat N/A
  • Thickness 500.0um士25.0um
  • Polytype 4H
  • Type n-type

Power Electronics Devices

By growing silicon carbide epitaxial layer on the n-Type silicon carbide substrate, the silicon carbide homogenous epitaxial wafer can be further made into SBD, MOSFET, IGBT and other power devices, which are applied in the fields of EV, rail transit and high power transmission and transformation.

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